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Heat Conduction inside of High and Low Temperature Test Chamber

Heat conduction depends on thermal characteristics of connection shelf and other connection parts.  If material of internal chamber has fine thermal conduction property and connection parts with good heat conduction ability are installed, then heat will be effectively distributed inside of test chamber.

Test chamber standards regulate the heat conductivity. If high and low temperature test chamber have more than one installed components for heat conduction, we need consider the worst scenarios. Different worst scenarios include:

1.       High temperature test for heat dissipation test samples.  For that heat conduction direction during that kind of tests is from test samples to sample shelf. Hence worst scenario will happen if sample shelves’ heat conduction is the lowest.

2.       High temperature test for non-heat-dissipation test samples.

3.       Low temperature test for heat dissipation and non-heat-dissipation test samples.

High and low temperature test chamber’s heat conduction principle can be categorized to three types: thermal convection, thermal radiation and thermal conduction.

 

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